Single-sided with ED Cu foil
    Published:2014-07-04 13:47 :admin Visits:
    Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.

    Product Specifications:
    Base Film: PI (Polyimide) film
    Thickness of PI: 0.5/1mil (12.5/25um)
    Thickness of copper foil: 12um-35um
    Construction: Single/Double-sided
    * Halogen-free 
    * Excellent dip soldering resistance
    * High bond and peel strength
    * Good chemical resistance
    * Good dimensional stability
    * Excellent dielectric properties
    * Good flammability and UL94 V-0

    Technical Index:
    Item Unit Condition Spec Control Value Test method
    Thickness μm As received +/-20% +/-10% Hongyang  Spec
    Width mm As received +/-1 +/-0.5 Hongyang  Spec
    Peel strength As Received N/mm  
    ≥0.7 ≥1.2  
    Chemical Resistance(MEK10min) ≥0.6 ≥1.0
    Dip soldering resistance 10sec 288*10S 320*10S IPC-TM-650 2.4.13
    MIT (500g. 0.8R) Times RA Cu 100-300 ≥1000 JISC-6471
    Dimensional Stability Method BMD/TD % B.after etching
    +/-0.15 ≤+/-0.1 IPC-TM-650 2.2.4.
    Method CMD/TD +/-0.2 ≤+/-0.1
    Water Absorption % 2.00 ≤1.00 IPC TM 650 2.6.2
    Insulation Resistance Surface Ω Ω C-96/23/65 107 1012 IPC-TM-650 2.5.17
    Volume Ω-cm 109 1013
    Bear Medicine Character
    mm IPA 1.0 Visual inspection  
    IPC-TM 650 2.3.2
    2mol/L HCL
    2mol/L  NaOH
    Halogen Free ppm RoHS Cl+Br<900ppm 465 SGS
    UL Flame Class Grade V-0 pass pass UL94 V-0
    Shelf life months 28≤65% 12 12 Hongyang Spec

    The above figures are typical data, not guaranteed data. 
    Remark: we can manufacture meterials according to the request of user.
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